منابع مشابه
Statistical analysis of tin whisker growth
As the result of the global movement to lead-free electronics, companies which assemble semiconductor devices are switching from finishes incorporating lead to pure tin or high tin lead-free alloys. This transition has resulted in a reliability issue, concerning the formation of conductive tin whiskers which can grow across leads of a package and cause current leakage or short circuits. This pa...
متن کاملInternal Microstructure Investigation of Tin Whisker Growth Using FIB Technology
The problem of tin (Sn) whiskers has been a significant reliability issue in electronics for the past several decades. Despite the large amount of research conducted on this issue, a solution for mitigating the growth of whiskers remains a challenge for the research community. Whiskers have unpredictable growth and morphology, and a study of a whisker’s internal structure may provide further in...
متن کاملMechanism and Prevention of Spontaneous Tin Whisker Growth
Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095-1595, USA Department of Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei 106, Taiwan, R. O. China Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, CA 94720, USA Institute of Microelectronics, Science Park 2, Singapore...
متن کاملassessment of deep word knowledge in elementary and advanced iranian efl learners: a comparison of selective and productive wat tasks
testing plays a vital role in any language teaching program. it allows teachers and stakeholders, including program administrators, parents, admissions officers and prospective employers to be assured that the learners are progressing according to an accepted standard (douglas, 2010). the problems currently facing language testers have both practical and theoretical implications but the first i...
The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth
Tin (Sn) is a key industrial material in coatings on various components in the electronics industry. However, Sn is prone to the development of filament-like whiskers, which is the leading cause of many types of damage to electronics reported in the last several decades. Due to its properties, a tin-lead (Sn-Pb) alloy coating can mitigate Sn whisker growth. However, the demand for Pb-free surfa...
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ژورنال
عنوان ژورنال: Journal of the Ceramic Association, Japan
سال: 1975
ISSN: 0009-0255,1884-2127
DOI: 10.2109/jcersj1950.83.962_510